RFT uses a high temperature brazing process that yields the lowest possible thermal resistance
and allows for higher temperature operation. Higher temperature processing also ensures greater
reliability and overall performance during thermal cycling. RFT devices are capable of
withstanding a 1 1/2 to 3 lbs pull test. The device will withstand substantial forces applied to the
lead due to different rates of contraction and expansion of the lead during temperature variations.
Since RFT devices are brazed, the customer need not have to worry about leads coming off
during soldering operations.